NXP USA Inc.
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- Package / Case 448-FBGA Exposed Pad Remove This Item
- Base Product Number LS101 Remove This Item
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Images
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Mfr. Part#
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Quantity
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Availability
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Pricing
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RoHS Status
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Series
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Package
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Product Status
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Package / Case
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Supplier Device Package
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Base Product Number
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IC PROCESSOR DUAL CORE
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Out of stock
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ROHS3 Compliant | QorlQ LS1 | Tray | Obsolete | 448-FBGA Exposed Pad | 448-PBGA w/Heat Spreader (23x23) | LS101 | |
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IC PROCESSOR DUAL CORE
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Out of stock
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ROHS3 Compliant | QorlQ LS1 | Tray | Obsolete | 448-FBGA Exposed Pad | 448-PBGA w/Heat Spreader (23x23) | LS101 | |
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IC PROCESSOR DUAL CORE
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Out of stock
|
ROHS3 Compliant | QorlQ LS1 | Tray | Obsolete | 448-FBGA Exposed Pad | 448-PBGA w/Heat Spreader (23x23) | LS101 | |
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|
IC PROCESSOR DUAL CORE
|
|
Out of stock
|
ROHS3 Compliant | QorlQ LS1 | Tray | Obsolete | 448-FBGA Exposed Pad | 448-PBGA w/Heat Spreader (23x23) | LS101 | |
|
|
IC PROCESSOR DUAL CORE
|
|
Out of stock
|
ROHS3 Compliant | QorlQ LS1 | Tray | Obsolete | 448-FBGA Exposed Pad | 448-PBGA w/Heat Spreader (23x23) | LS101 |